Lead-Free SAC305 Solder Paste No Clean 5cc Syringe.

DESCRIPTION:

Chemtools SAC305CR318 is designed for the most demanding high-density electronic assemblies. SAC305CR318 has been developed to offer excellent wetting, improved printing, and reduced voiding. The superior wetting ability of SAC305CR318 results in bright, smooth, and shiny solder joints with SAC alloys. An innovative activator system offers excellent wetting in a wide range of profiles. Enhanced wetting will reduce voiding on QFN ground planes, LGA and BGA interconnects. SAC305CR318 consistent transfer efficiencies reduce head-in-pillow (HiP) even when component/substrate co-planarity is not optimal. SAC305CR318 is also available in 10g syringes with higher flux content to normal stencil grade solder paste for rework and low volume production.

FEATURES:

• For Use with Demanding High-Density Electronic Assemblies
• Reduced Head-in-Pillow
• Extremely Stable Formula
• Extended Pause-to-Print Process Window
• Reduces Voiding on QFN Ground Pads
• Improved Printing Characteristics
• ROL0 per J-STD-004B
• REACH Compliant

PRINTING:

•  Apply sufficient paste to the stencil to allow a smooth, even roll during the print cycle. A bead diameter of 15-20mm (index finger) is sufficient.
• The application of small amounts of fresh solder paste to the stencil at controlled intervals will maintain paste chemistry rather than one large deposit over an extended period.
• CR318 is formulated to maintain excellent transfer efficiency after extended pauses, however, a knead cycle after pauses longer than 60 minutes will improve performance.
• Cleaning of your stencil will vary by application; however, if the solvent is required, use Chemtools CT-SKM stencil cleaner for the manual process. Contact your stencil printer supplier for options with regards to automatic machines.
• Isopropyl Alcohol (IPA) is NOT recommended for cleaning stencils during the printing process

REFLOW PROFILE:

Below are general guidelines for a ramp to spike (RTS) and ramp soak spike (RSS) Key differences are time to peak temperatures, and time above liquidus (TAL). The shorter profile is appropriate for low-medium thermal mass assemblies. The longer profile would apply to high-mass assemblies, such as backplanes and high thermal density boards. The extended time and temperature of an RSS profile are needed to minimize the ∆T of a high-mass
board. The shaded area defines the process window for SAC305CR318. Oven characteristics, board mass/density, component type, and IPC Acceptance Class all influence the final profile settings. These profiles are general guidelines and profile measurements with properly attached thermo-couples are highly recommended.

CLEANING:

Cleaning SAC305CR318 is not required; however, it can be cleaned if necessary with saponified water or an appropriate solvent cleaner such as Chemtools CT-DF solvent base or CT-PCBW VOC free flux remover.

HANDLING AND STORAGE:

• SAC305CR318 is best used within 6 months from date of manufacturer at 4° C-12° C (40° F- 55° F).
• Allow the solder paste to warm up completely and naturally to ambient temperature (8 hrs.) before breaking the seal for use.
• Mix the product lightly and thoroughly (1-2 minutes max).
• Do not store new and used paste in the same container.
• Reseal any opened containers while not in use.

PHYSICAL PROPERTIES:

TEST DATA SUMMARY:

The information contained herein is based on data considered accurate and is offered at no charge. Product information is based upon the assumption of proper handling and operating conditions. All information about solder paste is produced with 45-micron powder. Liability is expressly disclaimed for any loss or injury arising out of the use of this information or the use of any materials designated. For further details contact Chemtools for full terms and conditions.

Part Number/SKU: SAC305CR318S05-PT

* Product Images are for illustration purposes only, unless otherwise specified colour may be different.